Rapid Prototyping Lab

Existing Facilities:

Laser Machine ProtoLaser U3 (The Swiss Army Knife from LPKF):

Protolaser U3 is an ultra-fast and advanced PCB laser etching machine. The ProtoLaser U3 can etch circuits, drill holes, and depanel PCBs all in a single step. The ProtoLaser U3 provides a chemical-free process with no mechanical stress. A variety of materials from flexible ones to silicon can be etched and structured using the Protolaser U3.

• UV laser machine working at 355 nm.
• No mask, no mechanical stress, limited thermal stress and minimized debris.
• Material diversity (PCBs, flexible materials, silicon, Alumina, etc.).
• Maximum material size: 9” x 12”.
• Structuring, surface etching, depaneling, drilling, depth engraving, cutting, and skiving.
• Accuracy: 2µ.
• Reputability: ±2 µm.
• PCB structuring specs for I Oz copper thickness: minimum trace spacing= 20 µm,
minimum trace width= 50µ.

 

LPKF – ProtoLaser U3

Milling Machine Protomat S103 (LPKF):

The ProtoMat S103 provides precise, quick and simple in-house PCB prototyping, delivering PCBs in hours instead of days. Extensively equipped for multilayer and microwave and RF applications, the S103 is extremely fast and accurate, ensuring ultra-fine PCB prototyping. The system routes complex shapes and cut-outs, depanelizes populated PCBs, housing parts, or front panels, and processes substrates with delicate surfaces.

• Milling/drilling single & double sided PCBs.
• Highest available speed: 100000 rpm.
• Resolution: 0.5 µm.
• Reputability: ±µm.
• Pocketing mode.
• Precision of front-to-back alignment: 20 µm.
• Max. material size: 9” x 12”.
• No mechanical stress.
• Limited thermal stress.

LPKF – Protomat S103

Multilayer Press Multipress S (LPKF):

The LPKF MultiPress S is a bench-top multilayer press, ideal for creating multilayer circuit boards in a laboratory or prototyping environment. With a shorter pressing time of approximately ninety minutes, the system offers faster turnaround times than ever before.

• Maximum layout area: 8.2” x 11.2”.
• Maximum pressure: 286 N/cm2.
• Maximum number of layers: 8.

LPKF – Multilayer Press- Multipress S

Through-hole Plating Contac RS (LPKF):

The LPKF Contac RS and MiniContac RS are through-hole plating systems specially developed for the professional production of prototype and small batch production printed circuit boards, featuring Reverse Pulse Plating and unmatched ease-of-use. The systems are ideal for any rapid PCB prototyping situation, especially small runs and tight work locations.

• Reverse Pulse Plating (RPP) mode for having high quality plating.
• Maximum PCB size: 13” x 18”.
• Hole diameter: >200 µm.
• Ideal for through-hole plating multilayer PCBs.
• Number of through-plated holes: No limit.
• Maximum number of layers: 8.
• Maximum contact resistance: 10 mΩ.
• Chemical thinning: Yes.
• Activator: Carbon.

Through-hole Plating – Contac RS (LPKF)

SMD Rapid Prototyping:

ProtoPrintS (LPKF): Manual fine-pitch stencil printer for accurately positioning and dispensing solder paste onto PCBs.
LPKF ProtoFlow S: Reflow oven for lead-free soldering features a large material size and precisely controlled temperature profile.
LPKF ProtoPlace S: Pick&Place system for accurately positioning SMT components on PCBs – from small chips to large QFPs.

SMD Rapid Prototyping:

Die-Bonder Fine placer Lambda (Finetech):

The flexible Fine placer Lamda is a sub-micron die-bonder for precision die attach and advanced chip packaging. It offers a modular design and can be easily reconfigured for future applications, making it the premier choice when maximum technological versatility and fast process implementation is key.

• Placement accuracy: 0.5µm.
• Component size: Minimum 0.1 x 0.1 mm and Maximum 15 by 15 mm.
• Bonding force range: 0.1-400 N.
• Heating Temp. (Max.): 400o C.
• Precise die bonding (face up), laser bar bonding, photo diode bonding, LED bonding, Micro optics assembly, MEMS packaging, Sensor packaging, Bump Bonding, 3D packaging, Chip on glass, chip on flex.
• Unique optical resolution.
• Handles ultra small components with special tooling.
• Closed loop force control.
• Virtually unlimited range of advanced bonding technologies.
• User independent die placement and process operation.
• Provides high level of reproducibility and application flexibility.
• Synchronized control of all process related parameters: force, temperature, time, flow, power, process environment, light and vision.
• Flip chip bonding (face down).

Die-Bonder- Finplacer Lambda (Finetech)

Programmable Wire Bonder HB16 (tpt):

The HB16 is a bench top size wire bonder, ideal for small scale production line. One bond head for bonding a Ball/Wedge or Wedge/Wedge bonding mode.

• Bonding method: Wedge-Wedge, Ball-Wedge, Ribbon-bonding, Bump bonding, Gold and aluminium wire.
• Wire diameter: 17 – 70 µm.
• Ribbon size: maximum 25×250 µm.
• Electronic ball size control.

Programmable Wire Bonder- HB16 (tpt)